K6T4016C3B-TF550 vs TC55NEM216ATGN55 feature comparison

K6T4016C3B-TF550 Samsung Semiconductor

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TC55NEM216ATGN55 Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC TOSHIBA CORP
Part Package Code TSOP2 TSOP2
Package Description TSOP2, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, PLASTIC, TSOP2-54
Pin Count 44 54
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PDSO-G44 R-PDSO-G54
Length 18.41 mm 22.22 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 54
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 1 1
Rohs Code Yes
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code TSOP54,.46,32
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.000003 A
Standby Voltage-Min 2 V
Supply Current-Max 0.035 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare K6T4016C3B-TF550 with alternatives

Compare TC55NEM216ATGN55 with alternatives