K6T1008C2C-GF70
vs
HM628128DLFP-7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
RENESAS TECHNOLOGY CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP32,.56
SOP,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
JESD-609 Code
e0
Length
20.47 mm
20.45 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
-20 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP32,.56
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
3 mm
Standby Voltage-Min
2 V
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
11.43 mm
11.3 mm
Base Number Matches
1
2
Compare K6T1008C2C-GF70 with alternatives
Compare HM628128DLFP-7 with alternatives