K6R1008V1D-TI10 vs CY7C1019CV33-10ZXCT feature comparison

K6R1008V1D-TI10 Samsung Semiconductor

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CY7C1019CV33-10ZXCT Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC ROCHESTER ELECTRONICS LLC
Part Package Code TSOP2 TSOP2
Package Description 0.400 INCH, TSOP2-32 LEAD FREE, TSOP2-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Access Time-Max 10 ns 10 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0 e3
Length 20.95 mm 20.95 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Equivalence Code TSOP32,.46
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.005 A
Standby Voltage-Min 3 V
Supply Current-Max 0.075 mA
Supply Voltage-Max (Vsup) 3.6 V 3.63 V
Supply Voltage-Min (Vsup) 3 V 2.97 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 1 2

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