K6L1016C3B-RF700
vs
PDM41532LA20TATR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
IXYS CORP
Part Package Code
TSOP2
TSOP2
Package Description
TSOP2-R,
TSOP2,
Pin Count
44
44
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
20 ns
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
Length
18.41 mm
18.41 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX16
64KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2-R
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare K6L1016C3B-RF700 with alternatives
Compare PDM41532LA20TATR with alternatives