K6L0908V2A-YF700
vs
IS62C512-70U
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
TSOP1
SOIC
Package Description
TSSOP,
SOP,
Pin Count
32
32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
Length
11.8 mm
20.4285 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX8
64KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
3 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
8 mm
11.303 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
YES
Terminal Finish
TIN LEAD
Compare K6L0908V2A-YF700 with alternatives
Compare IS62C512-70U with alternatives