K6F8016U3A-RB55
vs
TC55YCM316BSGN70
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
TOSHIBA CORP
Part Package Code
TSOP2
TSOP1
Package Description
TSOP2-R, TSOP44,.46,32
TSOP1, TSSOP48,.55,20
Pin Count
44
48
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
85 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G44
R-PDSO-G48
Length
18.41 mm
12.4 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2-R
TSOP1
Package Equivalence Code
TSOP44,.46,32
TSSOP48,.55,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Reverse Pinout
YES
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.000006 A
Standby Voltage-Min
1.5 V
1 V
Supply Current-Max
0.04 mA
0.012 mA
Supply Voltage-Max (Vsup)
3.3 V
2.2 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
10.16 mm
12 mm
Base Number Matches
1
1
Compare K6F8016U3A-RB55 with alternatives
Compare TC55YCM316BSGN70 with alternatives