K6F4008U2G-EF550
vs
V62C31162048LL-35KI
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MOSEL-VITELIC
|
Part Package Code |
BGA
|
SOJ
|
Package Description |
VFBGA,
|
SOJ, SOJ44,.44
|
Pin Count |
36
|
44
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
55 ns
|
35 ns
|
JESD-30 Code |
R-PBGA-B36
|
R-PDSO-J44
|
Length |
7 mm
|
28.73 mm
|
Memory Density |
4194304 bit
|
2097152 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
36
|
44
|
Number of Words |
524288 words
|
131072 words
|
Number of Words Code |
512000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512KX8
|
128KX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
SOJ
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
3.7 mm
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
J BEND
|
Terminal Pitch |
0.75 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
6 mm
|
10.16 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e0
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
SOJ44,.44
|
Standby Current-Max |
|
0.000015 A
|
Standby Voltage-Min |
|
2 V
|
Supply Current-Max |
|
0.06 mA
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare K6F4008U2G-EF550 with alternatives
Compare V62C31162048LL-35KI with alternatives