K6F2016S4D-FF700 vs IS65WV12816ALL-70BA2 feature comparison

K6F2016S4D-FF700 Samsung Semiconductor

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IS65WV12816ALL-70BA2 Integrated Silicon Solution Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 7 mm 8 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX16 128KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.7 V 2.2 V
Supply Voltage-Min (Vsup) 2.3 V 1.65 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm 6 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Screening Level AEC-Q100
Standby Current-Max 0.000025 A
Standby Voltage-Min 1.2 V
Supply Current-Max 0.02 mA
Terminal Finish TIN LEAD

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Compare IS65WV12816ALL-70BA2 with alternatives