K6F2016S4D-FF700
vs
HY62QF16201ASLM-70I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SK HYNIX INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
FBGA,
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
7 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX16
128KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
2.7 V
2.8 V
Supply Voltage-Min (Vsup)
2.3 V
2.2 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
Base Number Matches
1
1
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Compare K6F2016S4D-FF700 with alternatives
Compare HY62QF16201ASLM-70I with alternatives