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K4X1G163PC-FGC30 vs K4X1G163PC-LGC30 feature comparison

K4X1G163PC-FGC30 Samsung Semiconductor

Buy Now Datasheet

K4X1G163PC-LGC30 Samsung Semiconductor

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description VFBGA, BGA60,9X10,32 VFBGA, BGA60,9X10,32
Pin Count 60 60
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 6 ns 6 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
Interleaved Burst Length 2,4,8,16 2,4,8,16
JESD-30 Code R-PBGA-B60 R-PBGA-B60
JESD-609 Code e1
Length 11.5 mm 11.5 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 16 16
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 64MX16 64MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA60,9X10,32 BGA60,9X10,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 8192
Seated Height-Max 1 mm 1 mm
Self Refresh YES YES
Sequential Burst Length 2,4,8,16 2,4,8,16
Standby Current-Max 0.000025 A 0.000025 A
Supply Current-Max 0.135 mA 0.135 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 11 mm
Base Number Matches 1 1
Memory » DRAMs
Memory » DRAMs

Compare K4X1G163PC-FGC30 with alternatives

Compare K4X1G163PC-LGC30 with alternatives