K4T1G084QF-BIE60
vs
K4T1G084QD-ZCE60
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG SEMICONDUCTOR INC
|
Package Description |
TFBGA, BGA60,9X11,32
|
TFBGA, BGA60,9X11,32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.32
|
8542.32.00.32
|
Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Access Time-Max |
0.45 ns
|
0.45 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
333 MHz
|
333 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
4,8
|
4,8
|
JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
Length |
9.5 mm
|
11 mm
|
Memory Density |
1073741824 bit
|
1073741824 bit
|
Memory IC Type |
DDR2 DRAM
|
DDR2 DRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
60
|
60
|
Number of Words |
134217728 words
|
134217728 words
|
Number of Words Code |
128000000
|
128000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Organization |
128MX8
|
128MX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA60,9X11,32
|
BGA60,9X11,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
4,8
|
4,8
|
Supply Current-Max |
0.145 mA
|
0.24 mA
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
7.5 mm
|
9 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
60
|
Operating Temperature-Max |
|
95 °C
|
Operating Temperature-Min |
|
|
Temperature Grade |
|
OTHER
|
|
|
|
Compare K4T1G084QF-BIE60 with alternatives
Compare K4T1G084QD-ZCE60 with alternatives