K4S28323LE-HR1L0
vs
K4S28323LE-HN1H0
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA,
|
TFBGA,
|
Pin Count |
90
|
90
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.02
|
8542.32.00.02
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
7 ns
|
7 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-PBGA-B90
|
R-PBGA-B90
|
Length |
13 mm
|
13 mm
|
Memory Density |
134217728 bit
|
134217728 bit
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
90
|
90
|
Number of Words |
4194304 words
|
4194304 words
|
Number of Words Code |
4000000
|
4000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Organization |
4MX32
|
4MX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
9 mm
|
9 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare K4S28323LE-HR1L0 with alternatives
Compare K4S28323LE-HN1H0 with alternatives