K4S283233E-SG1L0
vs
EDD2532DGBH-7FTT-F
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
ELPIDA MEMORY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA,
|
VFBGA,
|
| Pin Count |
90
|
90
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.24
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
7 ns
|
6 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
R-PBGA-B90
|
R-PBGA-B90
|
| Length |
13 mm
|
13 mm
|
| Memory Density |
134217728 bit
|
268435456 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM
|
DDR DRAM
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
90
|
90
|
| Number of Words |
4194304 words
|
8388608 words
|
| Number of Words Code |
4000000
|
8000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-20 °C
|
| Organization |
4MX32
|
8MX32
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
VFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.45 mm
|
1 mm
|
| Self Refresh |
YES
|
YES
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e1
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare K4S283233E-SG1L0 with alternatives
Compare EDD2532DGBH-7FTT-F with alternatives