K4M56323PG-HE90
vs
K4M56323PG-HG90T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Package Description
FBGA, BGA90,9X15,32
FBGA, BGA90,9X15,32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Time-Max
7 ns
7 ns
Clock Frequency-Max (fCLK)
111 MHz
111 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
1,2,4,8
1,2,4,8
JESD-30 Code
R-PBGA-B90
R-PBGA-B90
JESD-609 Code
e3
e3
Memory Density
268435456 bit
268435456 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
32
32
Moisture Sensitivity Level
1
1
Number of Terminals
90
90
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Organization
8MX32
8MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Equivalence Code
BGA90,9X15,32
BGA90,9X15,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
4096
Sequential Burst Length
1,2,4,8,FP
1,2,4,8,FP
Standby Current-Max
0.0003 A
0.0003 A
Supply Current-Max
0.14 mA
0.14 mA
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Compare K4M56323PG-HE90 with alternatives
Compare K4M56323PG-HG90T with alternatives