K4M563233G-FF7L
vs
HY57W2A3220T-SC
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SK HYNIX INC
|
Package Description |
FBGA, BGA90,9X15,32
|
TSOP2, TSSOP86,.46,20
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.24
|
8542.32.00.02
|
Access Time-Max |
5.4 ns
|
7 ns
|
Clock Frequency-Max (fCLK) |
133 MHz
|
100 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
1,2,4,8
|
1,2,4,8
|
JESD-30 Code |
R-PBGA-B90
|
R-PDSO-G86
|
Memory Density |
268435456 bit
|
134217728 bit
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
32
|
32
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
90
|
86
|
Number of Words |
8388608 words
|
4194304 words
|
Number of Words Code |
8000000
|
4000000
|
Operating Temperature-Max |
70 °C
|
80 °C
|
Operating Temperature-Min |
-25 °C
|
-10 °C
|
Organization |
8MX32
|
4MX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
TSOP2
|
Package Equivalence Code |
BGA90,9X15,32
|
TSSOP86,.46,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
4096
|
4096
|
Sequential Burst Length |
1,2,4,8,FP
|
1,2,4,8,FP
|
Standby Current-Max |
0.001 A
|
0.0006 A
|
Supply Current-Max |
0.16 mA
|
0.13 mA
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
TSOP2
|
Pin Count |
|
86
|
Access Mode |
|
FOUR BANK PAGE BURST
|
Additional Feature |
|
AUTO/SELF REFRESH
|
Length |
|
22.238 mm
|
Number of Functions |
|
1
|
Number of Ports |
|
1
|
Operating Mode |
|
SYNCHRONOUS
|
Output Characteristics |
|
3-STATE
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
1.194 mm
|
Self Refresh |
|
YES
|
Supply Voltage-Max (Vsup) |
|
2.7 V
|
Supply Voltage-Min (Vsup) |
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
|
2.5 V
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
10.16 mm
|
|
|
|
Compare K4M563233G-FF7L with alternatives
Compare HY57W2A3220T-SC with alternatives