K4M28323PH-FE1L0
vs
IS42S32400L-10B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
VFBGA, BGA90,9X15,32
BGA,
Pin Count
90
90
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
7 ns
7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
111 MHz
I/O Type
COMMON
Interleaved Burst Length
1,2,4,8
JESD-30 Code
R-PBGA-B90
R-PBGA-B90
Length
13 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
90
90
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Organization
4MX32
4MX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
BGA
Package Equivalence Code
BGA90,9X15,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
Seated Height-Max
1 mm
Self Refresh
YES
YES
Sequential Burst Length
1,2,4,8,FP
Standby Current-Max
0.0003 A
Supply Current-Max
0.095 mA
Supply Voltage-Max (Vsup)
1.95 V
2.7 V
Supply Voltage-Min (Vsup)
1.7 V
2.3 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare K4M28323PH-FE1L0 with alternatives
Compare IS42S32400L-10B with alternatives