K4H560838F-UCB0 vs K4H560838E-ULB0 feature comparison

K4H560838F-UCB0 Samsung Semiconductor

Buy Now Datasheet

K4H560838E-ULB0 Samsung Semiconductor

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Package Description TSSOP, TSSOP66,.46 TSSOP, TSSOP66,.46
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.24 8542.32.00.24
Access Time-Max 0.75 ns 0.75 ns
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
Interleaved Burst Length 2,4,8 2,4,8
JESD-30 Code R-PDSO-G66 R-PDSO-G66
Memory Density 268435456 bit 268435456 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Terminals 66 66
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32MX8 32MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP66,.46 TSSOP66,.46
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 8192
Sequential Burst Length 2,4,8 2,4,8
Standby Current-Max 0.003 A 0.003 A
Supply Current-Max 0.25 mA 0.25 mA
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1

Compare K4H560838F-UCB0 with alternatives

Compare K4H560838E-ULB0 with alternatives