K4H560838F-UCB0 vs HY5DU56822DF-L feature comparison

K4H560838F-UCB0 Samsung Semiconductor

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HY5DU56822DF-L SK Hynix Inc

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Pbfree Code Yes No
Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SK HYNIX INC
Package Description TSSOP, TSSOP66,.46 TBGA, BGA60,9X12,40/32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.24 8542.32.00.24
Access Time-Max 0.75 ns 0.75 ns
Clock Frequency-Max (fCLK) 133 MHz 125 MHz
I/O Type COMMON COMMON
Interleaved Burst Length 2,4,8 2,4,8
JESD-30 Code R-PDSO-G66 R-PBGA-B60
Memory Density 268435456 bit 268435456 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Terminals 66 60
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32MX8 32MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TBGA
Package Equivalence Code TSSOP66,.46 BGA60,9X12,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 8192
Sequential Burst Length 2,4,8 2,4,8
Standby Current-Max 0.003 A 0.01 A
Supply Current-Max 0.25 mA 0.18 mA
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.635 mm 1 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 2 1
Part Package Code BGA
Pin Count 60
Access Mode FOUR BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
Length 13 mm
Number of Functions 1
Number of Ports 1
Operating Mode SYNCHRONOUS
Seated Height-Max 1.17 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Width 8 mm

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