K4H511638C-ZPB3T
vs
MT46V32M16FN-6LIT:F
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Package Description
BGA, BGA60,9X12,40/32
10 X 12.50 MM, PLASTIC, FBGA-60
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Time-Max
0.7 ns
0.7 ns
Clock Frequency-Max (fCLK)
166 MHz
166 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
2,4,8
2,4,8
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e3
e0
Memory Density
536870912 bit
536870912 bit
Memory IC Type
CACHE DRAM MODULE
DDR1 DRAM
Memory Width
16
16
Moisture Sensitivity Level
1
Number of Terminals
60
60
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32MX16
32MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Equivalence Code
BGA60,9X12,40/32
BGA60,9X12,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Sequential Burst Length
2,4,8
2,4,8
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.38 mA
0.405 mA
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
60
Access Mode
FOUR BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
Length
12.5 mm
Number of Functions
1
Number of Ports
1
Operating Mode
SYNCHRONOUS
Seated Height-Max
1.2 mm
Self Refresh
YES
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Width
10 mm
Compare K4H511638C-ZPB3T with alternatives
Compare MT46V32M16FN-6LIT:F with alternatives