K4H511638C-UCCC vs DPDD32MX16WSCY5-DP-XX0715 feature comparison

K4H511638C-UCCC Samsung Semiconductor

Buy Now Datasheet

DPDD32MX16WSCY5-DP-XX0715 B&B Electronics Manufacturing Company

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC DPAC TECHNOLOGIES CORP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Time-Max 0.65 ns
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PDSO-G66 R-XDMA-G66
JESD-609 Code e6
Memory Density 536870912 bit 536870912 bit
Memory IC Type DDR1 DRAM DDR DRAM MODULE
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Terminals 66 66
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX16 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP
Package Equivalence Code TSSOP66,.46
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192
Sequential Burst Length 2,4,8
Standby Current-Max 0.005 A
Supply Current-Max 0.4 mA
Supply Voltage-Nom (Vsup) 2.6 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DMA
Package Description ,
Pin Count 66
Access Mode FOUR BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
Number of Functions 1
Number of Ports 1
Operating Mode SYNCHRONOUS
Self Refresh YES

Compare K4H511638C-UCCC with alternatives

Compare DPDD32MX16WSCY5-DP-XX0715 with alternatives