K4H510838B-NLB30 vs K4H510838B-VLB30 feature comparison

K4H510838B-NLB30 Samsung Semiconductor

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K4H510838B-VLB30 Samsung Semiconductor

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2 TSOP2
Package Description TSSOP, TSSOP,
Pin Count 54 54
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.7 ns 0.7 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G54 R-PDSO-G54
JESD-609 Code e0
Length 11.2 mm 11.2 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 54 54
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64MX8 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.4 mm 0.4 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 1 1
Moisture Sensitivity Level 2

Compare K4H510838B-NLB30 with alternatives

Compare K4H510838B-VLB30 with alternatives