K4H510438D-ULB0T
vs
K4H510438B-UCB0
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Package Description
TSSOP, TSSOP66,.46
TSSOP, TSSOP66,.46
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Time-Max
0.75 ns
0.75 ns
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
2,4,8
2,4,8
JESD-30 Code
R-PDSO-G66
R-PDSO-G66
JESD-609 Code
e3
Memory Density
536870912 bit
536870912 bit
Memory IC Type
CACHE DRAM MODULE
DDR1 DRAM
Memory Width
4
4
Moisture Sensitivity Level
1
3
Number of Terminals
66
66
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128MX4
128MX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP66,.46
TSSOP66,.46
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Sequential Burst Length
2,4,8
2,4,8
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.325 mA
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
260
Compare K4H510438D-ULB0T with alternatives
Compare K4H510438B-UCB0 with alternatives