K4F661611C-TC500
vs
MT4LC4M16U6TG-60
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Part Package Code
TSOP2
TSOP
Package Description
TSOP2,
0.400 INCH, PLASTIC, TSOP-50
Pin Count
50
50
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE
FAST PAGE WITH EDO
Access Time-Max
50 ns
60 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
RAS ONLY/CAS BEFORE RAS REFRESH
JESD-30 Code
R-PDSO-G50
R-PDSO-G50
Length
20.95 mm
20.95 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FAST PAGE DRAM
EDO DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
50
50
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
3.47 V
Supply Voltage-Min (Vsup)
4.5 V
3.13 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
10.16 mm
10.16 mm
Base Number Matches
1
1
JESD-609 Code
e0
Output Characteristics
3-STATE
Refresh Cycles
4096
Terminal Finish
TIN LEAD
Compare K4F661611C-TC500 with alternatives
Compare MT4LC4M16U6TG-60 with alternatives