K4D551638F-LC330
vs
K4D551638F-LC33
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
Package Description
TSSOP, TSSOP66,.46
TSSOP, TSSOP66,.46
Pin Count
66
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.6 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
300 MHz
300 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
2,4,8
2,4,8
JESD-30 Code
R-PDSO-G66
R-PDSO-G66
JESD-609 Code
e6
Length
22.22 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
GDDR1 DRAM
GDDR1 DRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
Number of Ports
1
Number of Terminals
66
66
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
65 °C
65 °C
Operating Temperature-Min
Organization
16MX16
16MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP66,.46
TSSOP66,.46
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Seated Height-Max
1.2 mm
Self Refresh
YES
Sequential Burst Length
2,4,8
2,4,8
Supply Current-Max
0.52 mA
0.52 mA
Supply Voltage-Max (Vsup)
2.95 V
Supply Voltage-Min (Vsup)
2.8 V
Supply Voltage-Nom (Vsup)
2.8 V
2.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
Base Number Matches
1
1
Pbfree Code
Peak Reflow Temperature (Cel)
260
Compare K4D551638F-LC330 with alternatives
Compare K4D551638F-LC33 with alternatives