K4D26323AA-GL450 vs NT5DS4M32EG-6 feature comparison

K4D26323AA-GL450 Samsung Semiconductor

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NT5DS4M32EG-6 Nanya Technology Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC NANYA TECHNOLOGY CORP
Part Package Code BGA BGA
Package Description LFBGA, LFBGA, BGA144,12X12,32
Pin Count 144 144
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.7 ns 0.7 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code S-PBGA-B144 S-PBGA-B144
Length 12 mm 12 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type DDR DRAM DDR1 DRAM
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 4MX32 4MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 12 mm 12 mm
Base Number Matches 1 1
Rohs Code Yes
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE
Package Equivalence Code BGA144,12X12,32
Refresh Cycles 4096
Sequential Burst Length 2,4,8,FP
Temperature Grade COMMERCIAL

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Compare NT5DS4M32EG-6 with alternatives