K4D263238K-GC500
vs
M13S128324A-6BIG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
LFBGA,
Pin Count
144
144
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.7 ns
0.7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e0
Length
12 mm
12 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
GDDR1 DRAM
DDR DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
65 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX32
4MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.325 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
12 mm
12 mm
Base Number Matches
1
1
Compare K4D263238K-GC500 with alternatives
Compare M13S128324A-6BIG with alternatives