K4C89363AF-GCF6 vs MT49H8M36HU-5 feature comparison

K4C89363AF-GCF6 Samsung Semiconductor

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MT49H8M36HU-5 Micron Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA144,12X18,40/32 FBGA-144
Pin Count 144 144
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.5 ns 0.5 ns
Additional Feature AUTO/SELF REFRESH AUTO REFRESH
Clock Frequency-Max (fCLK) 333 MHz 200 MHz
I/O Type COMMON COMMON
Interleaved Burst Length 2,4
JESD-30 Code R-PBGA-B144 R-PBGA-B144
JESD-609 Code e0 e0
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR1 DRAM DDR DRAM
Memory Width 36 36
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8MX36 8MX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TBGA
Package Equivalence Code BGA144,12X18,40/32 BGA144,12X18,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Self Refresh YES
Sequential Burst Length 2,4 2,4,8
Supply Voltage-Max (Vsup) 2.625 V 1.9 V
Supply Voltage-Min (Vsup) 2.375 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
Length 18.5 mm
Seated Height-Max 1.2 mm
Width 11 mm

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