K4C89183AF-GCF5
vs
K4C89183AF-GCF60
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA60,6X15,40
TBGA,
Pin Count
60
60
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.6 ns
0.5 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e0
e0
Memory Density
301989888 bit
301989888 bit
Memory IC Type
DDR1 DRAM
DDR1 DRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX18
16MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Equivalence Code
BGA60,6X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
YES
Sequential Burst Length
2,4
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Length
15.5 mm
Seated Height-Max
1.2 mm
Width
10 mm
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Compare K4C89183AF-GCF60 with alternatives