K4B4G0846B-MCH90
vs
EDJ4208BASE-DJ-F
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MICRON TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
LFBGA, BGA78,9X13,32
|
FBGA, BGA78,9X13,32
|
Pin Count |
78
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.36
|
8542.32.00.36
|
Access Mode |
MULTI BANK PAGE BURST
|
|
Access Time-Max |
0.255 ns
|
0.255 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
|
Clock Frequency-Max (fCLK) |
667 MHz
|
667 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PBGA-B78
|
R-PBGA-B78
|
Length |
11.5 mm
|
|
Memory Density |
4294967296 bit
|
4294967296 bit
|
Memory IC Type |
DDR3 DRAM
|
DDR3 DRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
|
Number of Ports |
1
|
|
Number of Terminals |
78
|
78
|
Number of Words |
536870912 words
|
536870912 words
|
Number of Words Code |
512000000
|
512000000
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
512MX8
|
512MX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
FBGA
|
Package Equivalence Code |
BGA78,9X13,32
|
BGA78,9X13,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Seated Height-Max |
1.5 mm
|
|
Self Refresh |
YES
|
|
Standby Current-Max |
0.024 A
|
0.02 A
|
Supply Current-Max |
0.32 mA
|
0.325 mA
|
Supply Voltage-Max (Vsup) |
1.575 V
|
|
Supply Voltage-Min (Vsup) |
1.425 V
|
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
10 mm
|
|
Base Number Matches |
1
|
2
|
Interleaved Burst Length |
|
4,8
|
Sequential Burst Length |
|
4,8
|
|
|
|
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