K4B2G0846C-HYK00
vs
MT41K256M8HX-15E:D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA, BGA78,9X13,32
Pin Count
78
78
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Alternate Memory Width
4
JESD-30 Code
R-PBGA-B78
R-PBGA-B78
Length
11 mm
11.5 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
DDR DRAM
DDR3L DRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
78
78
Number of Words
268435456 words
268435456 words
Number of Words Code
256000000
256000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
95 °C
85 °C
Operating Temperature-Min
Organization
256MX8
256MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.575 V
1.45 V
Supply Voltage-Min (Vsup)
1.425 V
1.283 V
Supply Voltage-Nom (Vsup)
1.5 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
7.5 mm
9 mm
Base Number Matches
1
2
Pbfree Code
Rohs Code
Access Mode
MULTI BANK PAGE BURST
Clock Frequency-Max (fCLK)
667 MHz
I/O Type
COMMON
Interleaved Burst Length
8
JESD-609 Code
e1
Output Characteristics
3-STATE
Package Equivalence Code
BGA78,9X13,32
Refresh Cycles
8192
Sequential Burst Length
8
Standby Current-Max
0.012 A
Supply Current-Max
0.385 mA
Terminal Finish
TIN SILVER COPPER
Compare K4B2G0846C-HYK00 with alternatives
Compare MT41K256M8HX-15E:D with alternatives