JM38510/31303BCA vs M38510/31303BCC feature comparison

JM38510/31303BCA Motorola Mobility LLC

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M38510/31303BCC SRI International Sarnoff

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC SRI INTERNATIONAL
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Length 19.495 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 52 ns 52 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 4 2
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Power Supply Current-Max (ICC) 14 mA
Prop. Delay@Nom-Sup 52 ns
Schmitt Trigger YES
Screening Level 38535Q/M;38534H;883B

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Compare M38510/31303BCC with alternatives