JM38510/30903BFA vs DM74LS453J feature comparison

JM38510/30903BFA Motorola Mobility LLC

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DM74LS453J National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DFP
Package Description DFP, DIP, DIP24,.3
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDFP-F16 R-GDIP-T24
Length 9.65 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 4
Number of Outputs 1 1
Number of Terminals 16 24
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Propagation Delay (tpd) 48 ns 40 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.15 mm 5.715 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 6.415 mm 7.62 mm
Base Number Matches 3 2
Rohs Code No
Additional Feature OPTEMP SPECIFIED AS TC
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Package Equivalence Code DIP24,.3
Power Supply Current-Max (ICC) 100 mA
Prop. Delay@Nom-Sup 40 ns
Terminal Finish TIN LEAD

Compare JM38510/30903BFA with alternatives

Compare DM74LS453J with alternatives