JM38510/30605BCA
vs
N74LS164N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
RIGHT
RIGHT
Family
LS
LS
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Length
19.495 mm
19.09 mm
Logic IC Type
SERIAL IN PARALLEL OUT
SERIAL IN PARALLEL OUT
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
56 ns
32 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.06 mm
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
35 MHz
25 MHz
Base Number Matches
3
4
JESD-609 Code
e0
Max Frequency@Nom-Sup
25000000 Hz
Package Equivalence Code
DIP14,.3
Terminal Finish
Tin/Lead (Sn/Pb)
Compare JM38510/30605BCA with alternatives
Compare N74LS164N with alternatives