JM38510/30005BDB vs JM38510/07005BCA feature comparison

JM38510/30005BDB Philips Semiconductors

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JM38510/07005BCA NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP SIGNETICS CORP
Package Description , ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS S
JESD-30 Code R-CDFP-F14 R-GDIP-T14
Load Capacitance (CL) 15 pF 15 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Power Supply Current-Max (ICC) 3.3 mA 9 mA
Propagation Delay (tpd) 15 ns 5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form FLAT THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 5

Compare JM38510/30005BDB with alternatives

Compare JM38510/07005BCA with alternatives