JM38510/30005BDA vs M38510/30005BCA feature comparison

JM38510/30005BDA Philips Semiconductors

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M38510/30005BCA Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP TEXAS INSTRUMENTS INC
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-CDFP-F14 R-GDIP-T14
Load Capacitance (CL) 15 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Power Supply Current-Max (ICC) 3.3 mA 3.3 mA
Propagation Delay (tpd) 15 ns 24 ns
Qualification Status Not Qualified Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form FLAT THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 7 11
Pbfree Code Yes
Rohs Code No
Part Package Code DIP
Pin Count 14
JESD-609 Code e0
Length 19.56 mm
Max I(ol) 0.001 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 24 ns
Schmitt Trigger NO
Screening Level MIL-PRF-38535 Class B
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 6.67 mm

Compare JM38510/30005BDA with alternatives

Compare M38510/30005BCA with alternatives