JM38510/30005BCC vs SN74LS10J feature comparison

JM38510/30005BCC NXP Semiconductors

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SN74LS10J Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LS
JESD-30 Code R-GDIP-T14 R-XDIP-T14
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3
Number of Inputs 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 3.3 mA 3.3 mA
Propagation Delay (tpd) 15 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 5
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.008 A
Package Equivalence Code DIP14,.3
Power Supplies 5 V
Prop. Delay@Nom-Sup 15 ns
Schmitt Trigger NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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