JM38510/30001BDX
vs
JM38510/30001SDA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DFP
|
DFP
|
| Package Description |
DFP,
|
CERAMIC, DFP-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-GDFP-F14
|
R-GDFP-F14
|
| Length |
9.65 mm
|
9.21 mm
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Propagation Delay (tpd) |
24 ns
|
15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.15 mm
|
2.03 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.415 mm
|
6.285 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
No
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e0
|
| Max I(ol) |
|
0.0004 A
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
MIL-M-38510 Class S
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare JM38510/30001BDX with alternatives
Compare JM38510/30001SDA with alternatives