JM38510/17101BCA
vs
HEF4071BPB
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-CDIP-T14
|
R-PDIP-T14
|
Logic IC Type |
OR GATE
|
OR GATE
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Propagation Delay (tpd) |
250 ns
|
115 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
Length |
|
19.025 mm
|
Load Capacitance (CL) |
|
50 pF
|
Seated Height-Max |
|
4.2 mm
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare JM38510/17101BCA with alternatives
Compare HEF4071BPB with alternatives