JM38510/07010BEA vs M38510/07010BEX feature comparison

JM38510/07010BEA NXP Semiconductors

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M38510/07010BEX Lansdale Semiconductor Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP LANSDALE SEMICONDUCTOR INC
Package Description , DIP,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family S S
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 1 1
Number of Inputs 12 12
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 25 mA
Propagation Delay (tpd) 7.5 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16

Compare JM38510/07010BEA with alternatives

Compare M38510/07010BEX with alternatives