JM38510/07006BCA vs GD74S20 feature comparison

JM38510/07006BCA Texas Instruments

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GD74S20 LG Semicon Co Ltd

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Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC LG SEMICON CO LTD
Part Package Code DIP
Package Description CERAMIC, DIP-14 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family S
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0 e0
Length 19.56 mm
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.0004 A 0.02 A
Number of Functions 2
Number of Inputs 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Power Supply Current-Max (ICC) 9 mA 18 mA
Prop. Delay@Nom-Sup 9 ns 5 ns
Propagation Delay (tpd) 5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level MIL-M-38510 Class B
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 5 2
Package Equivalence Code DIP14,.3

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