JANTXV1N749CUR-1
vs
JAN1N749CUR-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
COMPENSATED DEVICES INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
unknown
compliant
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
4.3 V
4.3 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
2%
2%
Working Test Current
20 mA
20 mA
Base Number Matches
1
1
Rohs Code
Package Description
MELF-2
Factory Lead Time
20 Weeks
Dynamic Impedance-Max
18 Ω
JESD-609 Code
e0
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Reverse Current-Max
2 µA
Reverse Test Voltage
1 V
Terminal Finish
Tin/Lead (Sn/Pb)
Compare JANTXV1N749CUR-1 with alternatives
Compare JAN1N749CUR-1 with alternatives