JANTXV1N6843CCU3
vs
JANTX1N6843CCU3
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
ROHS COMPLIANT, SMD0.5, 3 PIN
|
ROHS COMPLIANT, SMD0.5, 3 PIN
|
Pin Count |
3
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.80
|
|
Samacsys Manufacturer |
Microsemi Corporation
|
Microchip
|
Additional Feature |
LOW LEAKAGE CURRENT, LOW POWER LOSS
|
LOW LEAKAGE CURRENT, LOW POWER LOSS
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
COMMON CATHODE, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.6 V
|
0.6 V
|
JESD-30 Code |
R-CBCC-N3
|
R-CBCC-N3
|
JESD-609 Code |
e4
|
e4
|
Non-rep Pk Forward Current-Max |
100 A
|
100 A
|
Number of Elements |
2
|
2
|
Number of Phases |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Output Current-Max |
10 A
|
10 A
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Standard |
MIL-19500
|
MIL-19500
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
YES
|
YES
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
GOLD OVER NICKEL
|
GOLD OVER NICKEL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
2
|
Factory Lead Time |
|
35 Weeks
|
|
|
|