JANTXV1N6626U
vs
JANTXV1N6626US
feature comparison
Pbfree Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Part Package Code |
MELF
|
|
Package Description |
HERMETIC, MELF-B, 2 PIN
|
GLASS, D-5B PACKAGE, 2 PIN
|
Pin Count |
2
|
2
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
ULTRA FAST RECOVERY
|
ULTRA FAST RECOVERY POWER
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.35 V
|
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
Non-rep Pk Forward Current-Max |
75 A
|
75 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Output Current-Max |
2 A
|
4 A
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL
|
MIL-19500/590F
|
Rep Pk Reverse Voltage-Max |
200 V
|
|
Reverse Recovery Time-Max |
0.03 µs
|
0.03 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
No
|
Manufacturer Package Code |
|
D-5B PACKAGE
|
Samacsys Manufacturer |
|
Microsemi Corporation
|
Additional Feature |
|
METALLURGICALLY BONDED
|
JESD-609 Code |
|
e0
|
Technology |
|
AVALANCHE
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
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