JANTXV1N6476US
vs
1N6476US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SEMTECH CORP
Package Description
GLASS PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
unknown
Breakdown Voltage-Min
54 V
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
O-LELF-R2
O-LELF-N2
JESD-609 Code
e0
Non-rep Peak Rev Power Dis-Max
1500 W
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
3 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/552C
Rep Pk Reverse Voltage-Max
51.6 V
Surface Mount
YES
YES
Technology
AVALANCHE
AVALANCHE
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
NO LEAD
Terminal Position
END
END
Base Number Matches
5
5
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Factory Lead Time
18 Weeks
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Compare JANTXV1N6476US with alternatives
Compare 1N6476US with alternatives