JANTXV1N6318CUS
vs
JAN1N6318CUS
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
MELF-2
|
MELF-2
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
28 Weeks
|
|
| Additional Feature |
HIGH RELIABILITY, METALLURGICALLY BONDED
|
HIGH RELIABILITY, METALLURGICALLY BONDED
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-GELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Reference Standard |
MIL-19500
|
MIL-19500
|
| Reference Voltage-Nom |
5.6 V
|
5.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Voltage Tol-Max |
2%
|
2%
|
| Working Test Current |
20 mA
|
20 mA
|
| Base Number Matches |
4
|
4
|
| Part Package Code |
|
MELF
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Dynamic Impedance-Max |
|
8 Ω
|
| Knee Impedance-Max |
|
1200 Ω
|
| Reverse Current-Max |
|
5 µA
|
| Reverse Test Voltage |
|
2.5 V
|
|
|
|
Compare JANTXV1N6318CUS with alternatives
Compare JAN1N6318CUS with alternatives