JANTXV1N5809US
vs
JANTXV1N5809US
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SEMTECH CORP
MICROSEMI CORP
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED, GLASS, MELF-2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Factory Lead Time
100 Weeks
Samacsys Manufacturer
SEMTECH
Microsemi Corporation
Application
SUPER FAST SOFT RECOVERY
ULTRA FAST RECOVERY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.875 V
JESD-30 Code
O-LELF-R2
O-LELF-R2
Non-rep Pk Forward Current-Max
125 A
125 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Output Current-Max
6 A
3 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500/477
MIL-19500
Rep Pk Reverse Voltage-Max
100 V
100 V
Reverse Recovery Time-Max
0.03 µs
0.03 µs
Surface Mount
YES
YES
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
MELF
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
JESD-609 Code
e0
Operating Temperature-Min
-65 °C
Power Dissipation-Max
5 W
Terminal Finish
TIN LEAD
Compare JANTXV1N5809US with alternatives
Compare JANTXV1N5809US with alternatives