JANTXV1N5614
vs
1N5614X
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
SEMTECH CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED PACKAGE-2
GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Factory Lead Time
100 Weeks
Additional Feature
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.2 V
1.3 V
JESD-30 Code
O-XALF-W2
O-LALF-W2
Non-rep Pk Forward Current-Max
50 A
30 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Output Current-Max
1 A
1 A
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Rep Pk Reverse Voltage-Max
200 V
200 V
Reverse Recovery Time-Max
2 µs
2 µs
Surface Mount
NO
NO
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
8
3
Rohs Code
Breakdown Voltage-Min
220 V
JEDEC-95 Code
DO-41
JESD-609 Code
e0
Reverse Current-Max
1 µA
Reverse Test Voltage
200 V
Terminal Finish
TIN LEAD
Compare JANTXV1N5614 with alternatives
Compare 1N5614X with alternatives