JANTXV1N5529CUR-1 vs 1N5529CUR-1 feature comparison

JANTXV1N5529CUR-1 Microchip Technology Inc

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1N5529CUR-1 Cobham Advanced Electronic Solutions

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC AEROFLEX MICROELECTRONIC SOLUTIONS
Package Description HERMETIC SEALED, GLASS, MLL34, MELF-2
Reach Compliance Code compliant unknown
Factory Lead Time 20 Weeks
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 45 Ω 45 Ω
JEDEC-95 Code DO-213AA
JESD-30 Code R-LELF-R2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape RECTANGULAR
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 9.1 V 9.1 V
Surface Mount YES YES
Technology AVALANCHE
Terminal Finish TIN LEAD
Terminal Form WRAP AROUND
Terminal Position END
Voltage Tol-Max 2% 2%
Working Test Current 1 mA 1 mA
Base Number Matches 8 6
ECCN Code EAR99
HTS Code 8541.10.00.50

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