JANTXV1N5529B-1
vs
JAN1N5529B-1
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
VPT COMPONENTS
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-35
|
DO-204AH
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Qualified
|
Qualified
|
Reference Standard |
MIL-19500
|
MIL-19500
|
Reference Voltage-Nom |
9.1 V
|
9.1 V
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
1 mA
|
1 mA
|
Base Number Matches |
1
|
1
|
Package Description |
|
HERMETIC SEALED, GLASS, DO-35, 2 PIN
|
Factory Lead Time |
|
20 Weeks
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare JANTXV1N5529B-1 with alternatives
Compare JAN1N5529B-1 with alternatives