JANTXV1N5294UR-1
vs
JANS1N5294UR-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.70
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-XELF-R2
O-LELF-R2
Limiting Voltage-Max
1.2 V
1.2 V
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Qualified
Regulation Current-Nom (Ireg)
0.75 mA
0.75 mA
Surface Mount
YES
YES
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
8
8
Package Description
HERMETIC SEALED, GLASS, LL41, MELF-2
Factory Lead Time
32 Weeks
JESD-609 Code
e0
Moisture Sensitivity Level
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Rep Pk Reverse Voltage-Max
100 V
Terminal Finish
TIN LEAD
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